Hexagonal boron nitride

Hexagonal boron nitride is a layered ceramic combining electrical insulation, thermal conductivity and low-friction behavior. Its platelet structure supports heat transport and sliding between layers, while its insulating character distinguishes it from conductive carbon fillers. These properties are useful in polymer thermal-management compounds and release or lubrication systems.

The selected material is micron-scale h-BN powder rather than cubic boron nitride abrasive. It is dispersed into a polymer, coating or other host to contribute ceramic functionality. Thermal transport depends on platelet orientation, loading and particle contacts, so powder properties alone do not define a finished compound. In surface coatings, the layered particles instead provide slip and reduced adhesion at the contact interface.

Typical Applications

• Thermally conductive insulating compounds: Used as a filler in suitable silicone, epoxy or thermoplastic formulations for thermal interfaces, encapsulation and heat-management components.
• Release and protective coatings: Used in formulated coatings for suitable molds or high-temperature contact surfaces where reduced sticking is required.
• Solid-lubricant formulations: Used as a low-friction ceramic component in compatible greases, coatings or other lubricating systems.

Specifications

Specifications describe the standard grade. Tolerance, test method and documentation package are confirmed per order.